SSRM characterisation of FIB induced damage in silicon

نویسندگان

  • S Beuer
  • V Yanev
  • M Rommel
  • A J Bauer
  • H Ryssel
چکیده

Scanning spreading resistance microscopy (SSRM) has been applied to study focused ion beam (FIB) induced damage in silicon in dependence on ion irradiation doses from 10 cm to 2⋅10 cm. Starting from the lowest dose, SSRM detects increasing spreading resistance (SR) with increasing dose. For doses from 2⋅10 cm to 4⋅10 cm, a slight decrease of SR is measured whereas for higher doses SR again slightly increases. The results are explained by physical effects like decreased carrier mobility due to increased scattering, amorphisation of silicon and precipitation of implanted Ga ions. The results clearly prove that SSRM is well suited for the fast detection of ion beam induced damage with high lateral resolution.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Scanning Capacitance Microscopy Investigations of Focused Ion Beam Damage in Silicon

In this article, we explore the application of Scanning Capacitance Microscopy (SCM) for studying focused ion beam (FIB) induced damage in silicon. We qualitatively determine the technologically important beam shape by measuring the SCM image of FIB processed implantation spots and by comparison of topographical and SCM data. Further, we investigate the question how deep impinging ions generate...

متن کامل

Focused ion beam milling strategy for sub-micrometer holes in silicon

Focused ion beam (FIB) milling can be used as a tool to fabricate structures with sub-micrometer details. The slab material can be silicon, for example, which can then be used as a mould for nano-imprint lithography, or in silicon on insulator (SOI) layer configuration suitable for photonic applications. In the latter, additional effort has to be taken to prevent high FIB induced losses, due to...

متن کامل

A Study of Gallium FIB induced Silicon Amorphization using TEM, APT and BCA Simulation

Crystalline silicon (c-Si) is partially amorphized in Focused Ion Beam (FIB) TEM lamella preparation. A 30kV Ga beam with a small glancing incident results in a 20-30nm amorphous layer [1, 2]. The precise mechanisms remain uncertain and a damage prediction can hardly be made. In this study, a Binary Collision Approximation (BCA) software is employed to simulate c-Si amorphization in various Ga-...

متن کامل

Dopant Profiling on 4H Silicon Carbide P+N Junction by Scanning Probe and Secondary Electron Microscopy

The availability of two-dimensional (2-D) dopant profiling techniques to Silicon Carbide (SiC) pn junction is discussed. We compared the results of scanning capacitance microscopy (SCM), scanning spreading resistance microscopy (SSRM), and secondary electron microscopy (SEM), where the cross-sections of a SiC wafer with n-type epi-layers and highly-doped p and n regions were used. The SSRM curr...

متن کامل

Xe FIB Milling and Measurement of Amorphous Damage in Diamond

Microand nanomachining of diamond using focused ion beam (FIB) continues to generate interest in applications such as diamond anvil cells, photonic devices, micro-cantilevers and tools for imprinting applications [1,2]. However, the milling rate of diamond by FIB is approximate 4X slower when compared to silicon using 30 kV Ga FIB [3]. Recent instrumentation using PFIB technology and Xe ions of...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2007